Me yasa Tsarin Isar da Gas na UHP Yake da Muhimmanci?
A cikin masana'antar semiconductor - hanyoyin kamar etching, CVD, ion implantation, da lithography - iskar gas mai sarrafawa dole ne ta kasance mai tsarki sosai, yawanci 99.9999% (6N) ko ma 99.99999% (7N). Ko da gurɓatattun abubuwa a matakin ppb (sassa a kowace biliyan) ko ppt (sassa a kowace tiriliyan) - kamar danshi ko iskar oxygen - na iya haifar da lahani masu kisa kamar thinning oxide gate, string metallic voids, ko short da'irori akan wafers, wanda zai iya lalata dukkan wuraren.
Saboda haka, manufar tsarin isar da iskar gas na UHP shine jigilar iskar gas daga tushe zuwa kayan aikin sarrafawa ba tare da lalata tsafta ba, tare da hana gurɓatawa da zubewa a kowane wuri.
Me yasa bututun EP ya zama kashin bayan tsarin UHP?
An yi bututun EP (wanda aka goge da wutar lantarki) daga bakin karfe wanda ke yin aikin goge lantarki, wanda ke samar da saman ciki mai kama da madubi. Wannan ya sa ya zama "jijiyar jini" da ba makawa ga rarraba iskar gas ta UHP.
Tsafta ta Ƙarshe - Rigakafi a Tushe
Tsarin sarrafa EP yana rage ƙaiƙayin saman ciki (Ra) zuwa 0.13 µm – 0.25 µm ko ma ƙasa da haka. Wannan ƙare mai santsi sosai yana kawar da ƙananan ramuka da wuraren shaye-shaye, ba tare da barin sarari ga barbashi, ions na ƙarfe, ko danshi su manne ba.
Ingantaccen Juriyar Tsatsa - Tsaftacewa
Matakin gogewa na electropolising yana cire dattin saman kuma yana samar da wani Layer mai cike da chrome-oxide, wanda ke inganta juriya ga iskar gas mai lalata kamar Cl₂, CF₄, da HCl. Wannan yana hana tsatsawar bangon bututu wanda zai iya haifar da barbashi ko gurɓatar iskar gas.
Ingantaccen Ingancin Gudawa & Tsaftacewa da Sauri
Bangon ciki mai santsi yana rage juriyar kwarara kuma yana hanzarta tsarkakewa da maye gurbin iskar gas. A cikin hanyoyin da ke buƙatar saurin sauya iskar gas, wannan yana rage lokacin zagayowar kuma yana haɓaka ingantaccen fitarwa.
Kayan Aiki na Musamman - Ma'aunin "Kambi"
Ana ƙera bututun EP mai inganci daga ƙarfe mai ƙarfin 316L VIM‑VAR (Vacuum Induction Melting + Vacuum Arc Remelting). Wannan tsari na narkewa sau biyu yana tabbatar da cikakken tsarkin ƙarfen tushe, wanda shine babban abin da ake buƙata don cimma babban aikin EP.
Muhimman Yanayi na Aikace-aikace
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Tsarin Aiki na Musamman- Isar da iskar gas mai ƙarfi don cirewa, CVD, dasa ion, da lithography.
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Iskar Gas ta Musamman– Kula da iskar gas mai ƙonewa, mai guba, ko mai lalatawa lafiya kamar SiH₄, PH₃, Cl₂, da BCl₃. Ga iskar gas mai haɗari sosai, galibi ana amfani da bututun EP mai ɗauke da abubuwa biyu (bututun ciki don iskar gas, an kwashe jaket na waje ko an tsaftace shi da nitrogen don sa ido kan zubewa).
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Kayan aiki masu mahimmanci- Ana amfani da shi a cikin allunan rarraba gas (VMBs), kabad na gas, da kuma haɗin kayan aikin sarrafawa inda saman ciki mai tsafta sosai ya zama dole.
Bayan Tubing: Sauran Muhimman Abubuwa Don Cikakken Tsarin UHP
Domin tabbatar da cikakken sahihanci, tsarin dole ne ya haɗa da:
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Walda ta Orbital Mai Cikakken Atomatik– An yi shi a cikin ɗakunan tsaftacewa na ISO Class 5 (Aji 100) ko mafi kyau, yana kawar da bambance-bambancen walda da hannu da haɗarin gurɓatawa.
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Kayan Hatimin Fuska na Duk Karfe– Kamar nau'ikan VCR® ko W‑Seal, waɗanda suka dogara da gaskets na ƙarfe don aikin zubar da ruwa ba tare da kwarara ba.
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Tsaftacewa da Marufi Mai Tsauri- Ana tsaftace bututun EP da ruwa mai tsafta, a busar da su, sannan a tsaftace su da sinadarin nitrogen kafin a saka su a cikin jakar ajiya ta ɗaki biyu domin kiyaye tsarkinsu na "kamar yadda aka aika" har sai an shigar da su.
Bututun EP ba wai kawai bututu ba ne—shi ne layin farko na kariya a isar da iskar gas na semiconductor. Tsarinsa mai santsi sosai, juriyar tsatsa, da kuma tsabtar kayan aiki mai inganci suna shafar yawan amfanin wafer, amincin na'urori, da kuma ribar da ta dace gaba ɗaya. A duniyar ƙananan ƙwayoyin ƙasa da 5nm da kuma kasafin kuɗi mai tsauri, bututun EP ba zaɓi ba ne—abu ne mai mahimmanci.
Lokacin Saƙo: Agusta-05-2026